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Harper on Amazon. com. FREE shipping on qualifying offers. Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones Electronic Packaging and Interconnection Handbook 4E Responding To A Promotion? A Promo Code is an alphanumeric code that is attached to select promotions or advertisements that you may receive because you are a McGrawHill Professional customer or email alert subscriber.
Electronic Packaging and Interconnection Handbook 4E and a great selection of similar Used, New and Collectible Books available now at AbeBooks.
com. Electronic packaging is the underlying technology behind the creation of small electronic devices such as cell phones, PDAs, and laptops. Packaging advances in this field have driven the miniaturization of consumer electronics. This is THE standard reference in the field, nearly 75 rewritten to reflect the tremendous advances that have taken place in the past five years.
Provides a comprehensive reference in electronic packaging. This title offers a source of key reference data, practical guidance, and circuit and package design basics. It is intended for mechanical and electrical engineers, chemists, physicists, and materials scientists in various areas of the electronic packaging industry.
This is the second edition of the classic reference in the electronic packaging field, bringing together experts from across the industry to make sense of the very interdisciplinary field. This edition features over 50 new material, deleting many chapters entirely and bringing in new, stateoftheart material on interconnection technologies, multichip modules, BGA, and other new areas Buy Electronic Packaging and Interconnection Handbook 4E 4 by Charles A.
Harper (ISBN: ) from Amazon's Book Store. Everyday low prices and free delivery on eligible orders. Electronic Packaging and Interconnection Handbook 4E Chapter 5: Solder Technologies for Electronic Packaging and Assembly Chapter 6: Packaging and Interconnection of Integrated Circuits Chapter 7: Hybrid Microelectronics and Multichip Modules Chapter 8: Chip Scale, Flip Chip, and Advanced Chip Packaging Technologies